December 2017

Contents

Preface

• Remarks on Special Issue on New Materials
  Shunichi HAYASHI(322KB)

Technical Report

• High-performance Bonding Wires for Semiconductor Packaging
  Tomohiro UNO, Tetsuya OYAMADA, Takashi YAMADA, Taizo ODA(2.9MB)
• Bonding Technique for Power Semiconductors Using Ni Nanoparticles
  Norie MATSUBARA, Tomohiro UNO, Masayuki CHIBA, Takayuki SHIMIZU(2.9MB)
• Development of Newly Advanced Metal Substrates for Catalytic Converters
  Toru INAGUMA, Shogo KONYA, Yasuhiro TSUMURA, Masafumi OMIZU, Shinji KAWASOE, Masayuki KASUYA(5.2MB)
• Mechanical and Forming Properties of LAMINELITE^TM, Laminated Stainless Steel Foil for Battery Packaging
  Masaharu IBARAGI, Koichi NOSE, Hiroto UNNO, Naoki FUJIMOTO, Masahiro FUKUDA(3MB)
• Fabrication of Planarized Stainless Steel Foil for Flexible Substrate
  Noriko YAMADA, Sawako YAMAGUCHI, Jun NAKATSUKA, Yoshiaki HAGIWARA, Yutaka SEKIGUCHI(3.4MB)
• Development of New Reinforcement Method and 10T Magnetization of QMG^TM Magnet
  Mitsuru MORITA, Hidekazu TESHIMA, Shinya NARIKI(5.3MB)
• Spherical SiO₂ Filler for Semiconductor Sealing Materials
  Yutaka SATO, Katsumasa YAGI, Mutsuhito TANAKA, Masanori AE, Syouzou TOKUDA(1.9MB)
• Development of High Quality 4H-SiC Single Crystal Wafers Grown by Solution Growth Technique
  Kazuhiko KUSUNOKI, Kazuaki SEKI, Yutaka KISHIDA, Koji MORIGUCHI, Hiroshi KAIDO, Nobuhiro OKADA, Kazuhito KAMEI(2.9MB)
• Computational Materials Science for Developing Sophisticated Top Seeded Solution Growth (TSSG) Processes of Single Crystalline SiC
  Koji MORIGUCHI, Nobuhiro OKADA, Hiroshi KAIDO, Yutaka KISHIDA, Kazuhiko KUSUNOKI, Kazuaki SEKI, Kazuhito KAMEI(5.3MB)